• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to an improvement for a wafer mounting table particularly for use in photolithographic apparatus for processing wafers comprising a compact mounting block made of glass-ceramics which has two neighboring back supports limiting two sides of a top face of said mounting block. The top face is provided with at least three studs for supporting a wafer to be processed. The sides of the back-supports facing away from said top face are provided with an elongated horizontally extending silvered area each, which is in opposition to a laser path measuring system each. The laser beams of said laser path measuring system define a plane which coincides with a projection plane of a projection lens being provided in opposition to a wafer mounted on said studs. Means are provided for substantially eliminating departures of the silvered areas from a straight plane. Further means are provided which enable a quick adaption of the laser mount for wafer charges having different thicknesses or diameters.
    公开号:SU1359662A1
    申请号:SU847773406
    申请日:1984-05-21
    公开日:1987-12-15
    发明作者:Удо Баттиг；Петер Диттрих；Норберт Оертел；Гюнтер Остерланд；Матиас Рюккнагел；Вернер Шелер；Клаус Шултц
    申请人:Феб Карл-Цейсс Иена (Инопредприятие)；
    IPC主号:
    专利说明:

    The invention relates to a measuring, fielding technique, in particular, devices for monitoring and processing semiconductor wafers.
    A device for monitoring and processing semiconductor wafers is known, which also serves to align semiconductor wafers and contains a unit on which there is a receiving node for semiconductor wafers, which in turn has reflecting surfaces on orthogonal faces. On the block there is a laser system for measuring the path, the measuring beam of which falls on the reflecting surfaces and is reflected from them (US Patent No. 3786332, Cl. 318-571, 1974).
    The drawback of the device is that the semiconductor surface and the center of the measuring beam are not in the same plane. The misalignment and oblique positions encountered in this case can lead to erroneous measurements and positioning, since such misalignments entail first-order errors. This leads to positioning errors and. consequently to an increase in the marriage in the manufacture of semiconductor elements. The reason for these errors is: violation of the principle of comparison.,
    The purpose of the invention is to improve the accuracy of control and positioning.
    FIG. 1 shows schematically a receiving table for controlling and processing semiconductor wafers, a general view; in fig. 2 - glass ceramic
    Sh
    beams 7 and 8 of laser systems 9 and path measurements. With the aid of laser systems 9 and 10, path measurements that emit measuring beams 7 and 8, whose centers are precisely located in the plane of a semiconductor
    i
    Plate 3, positioning in two coordinates is possible with almost no errors. The substrates 2 for the semiconductor wafer 3 are suction nozzles 11, which prevent the semiconductor wafer 3 from sliding. At the suction 15 nozzles 11, adjusting sleeves 12 are fitted, which can be replaced with different semiconductor parts. By randomly selecting the sleeves 12 settings, you can reach the height settings. When processing smaller formats of semiconductor wafers 3, unnecessary suction nozzles 11 are locked by means of covering sleeves 13, and the surface of the mounted cover 20
    The 25 sleeves 13 are in a lower position than the surface of the tuning sleeves 12. The suction nozzles 11 are located in the recess of the table 1 so that between the suction nozzles 30 11 can handle the transport attachment. The test plate 14 (standard) is mounted on table 1 and has a precise line on the surface, which is captured by an overlap system (not shown), and the position of table 1 is adjusted to zero. Thus, it is possible to detect deviations between the line on the test plate 14 and the unevenness of the reflecting part, the suction nozzle and the semiconductors 5 and 6. The registered nickel plate, section} in FIG. 3 - with this method in a different coordinate, the execution of the suction nozzle with a shift corresponds to the generator head; figure 4 - table p flat reflective surfaces 5 and 6. -These
    35
    test plate (reference).
    The receiving table 1 has a recess in the middle in which there are three height-adjustable substrates 2, which in turn contain a semiconductor plate 3 installed at a certain distance from the surface of the table 1. Semiconductor plate 3 is bounded by x and y coordinates using stops 4 Table 1 is a single glass-ceramic unit, which has reflecting surfaces 5 and 6 on two orthogonal faces, which serve to reflect the incident measuring
    45
    50
    55
    values for both coordinates are recorded repeatedly. By arranging the nozzles 11, it is possible to install the flat test plate 14 parallel to the reflective surfaces 5 and 6 so that the surface of the test plate 14 is located in the focus plane.
    权利要求:
    Claims (1)
    [1]
    Invention Formula
    A receiving table for controlling and processing semiconductor wafers, consisting of a block with orthogonal faces, on which there are reflecting surfaces designed for.
    Sh
    59662.2
    beams 7 and 8 of laser systems 9 and path measurements. With the aid of laser systems 9 and 10, path measurements that emit measuring beams 7 and 8, whose centers are precisely located in the plane of a semiconductor
    i
    Plate 3, positioning in two coordinates is possible with almost no errors. The substrates 2 for the semiconductor wafer 3 are suction nozzles 11, which prevent the semiconductor wafer 3 from sliding. At the suction 15 nozzles 11, adjusting sleeves 12 are fitted, which can be replaced with different semiconductor parts. By randomly selecting the sleeves 12 settings, you can reach the height settings. When processing smaller formats of semiconductor wafers 3, unnecessary suction nozzles 11 are locked by means of covering sleeves 13, and the surface of the mounted cover 20
    The 25 sleeves 13 are down.
    values for both coordinates are recorded repeatedly. By arranging the nozzles 11, it is possible to install the flat test plate 14 parallel to the reflective surfaces 5 and 6 so that the surface of the test plate 14 is located in the focus plane.
    Invention Formula
    A receiving table for controlling and processing semiconductor wafers, consisting of a block with orthogonal faces, on which reflective surfaces are made, which are intended for positioning the measuring beams of laser path measuring systems in two coordinate directions, and on which the semiconductor plates are fixed at least three independently height-adjustable substrates, characterized in that the block consists of glass-ceramic and in the middle has a recess in which are arranged the height of the substrate.
    x
    1359662
    and the laser systems are installed in such a way that the intersection point of perpendicularly incident on the reflecting surfaces of the measuring beams is in the plane of the semiconductor wafer.
    It is recognized as an invention on the basis of the results of the examination carried out by the Office for the Invention of Germans-jcofi-Democratic Republic.
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    同族专利:
    公开号 | 公开日
    DD233284A3|1986-02-26|
    NL8401975A|1985-02-01|
    US4583847A|1986-04-22|
    FR2548353A1|1985-01-04|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    FR2388371B1|1977-04-20|1981-11-06|Thomson Csf|
    FR2429447B1|1978-06-23|1982-02-26|Thomson Csf|
    JPH0139207B2|1981-01-14|1989-08-18|Nikon Kk|
    US4431304A|1981-11-25|1984-02-14|Mayer Herbert E|Apparatus for the projection copying of mask patterns on a workpiece|US4775877A|1985-10-29|1988-10-04|Canon Kabushiki Kaisha|Method and apparatus for processing a plate-like workpiece|
    US4676649A|1985-11-27|1987-06-30|Compact Spindle Bearing Corp.|Multi-axis gas bearing stage assembly|
    JPH0722112B2|1987-07-30|1995-03-08|キヤノン株式会社|Mask holder and mask transfer method using the same|
    KR100208739B1|1993-07-08|1999-07-15|다나카 아키히로|Process and device for adjusting the distance between a workpiece and a mask|
    JP3401769B2|1993-12-28|2003-04-28|株式会社ニコン|Exposure method, stage device, and exposure device|
    JP3689949B2|1995-12-19|2005-08-31|株式会社ニコン|Projection exposure apparatus and pattern forming method using the projection exposure apparatus|
    US6111706A|1998-07-09|2000-08-29|Gerber Coburn Optical Inc.|Adjustable lens support assembly|
    DE19858428C2|1998-12-17|2002-09-12|Leica Microsystems|Coordinate-measuring arrangement|
    DE19948797C2|1999-10-11|2001-11-08|Leica Microsystems|Substrate holder and use of the substrate holder in a high-precision measuring device|
    JP4469462B2|2000-05-25|2010-05-26|株式会社ニコン|Carrier shape measuring machine|
    US6736361B2|2001-09-04|2004-05-18|Nline Corporation|Semiconductor wafer positioning system and method|
    US9435626B2|2011-08-12|2016-09-06|Corning Incorporated|Kinematic fixture for transparent part metrology|
    JP5932296B2|2011-11-02|2016-06-08|株式会社ディスコ|Processing equipment|
    FR3067105A1|2017-06-01|2018-12-07|Peugeot Citroen Automobiles Sa|APPARATUS FOR CONTROLLING THE PROFILE OF A BLADE OF A CRIMPING DEVICE|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    DD83252676A|DD233284A3|1983-07-01|1983-07-01|RECORDING TABLE FOR CHECKING AND MACHINING SEMICONDUCTED DISCS|
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